The IEEE International Conference on Flexible, Printable Sensors and Systems (IEEE FLEPS 2027) will be held in Cambridge, UK. IEEE FLEPS 2027 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
Topics of Interest
The topics of interests include, but are not limited to:
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Organic/Inorganic Electronics and Sensors
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Materials and Design for Flexible, Stretchable, and Printed Systems
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Advanced Manufacturing Techniques
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High-throughput Printable Electronics
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Hybrid Systems and Heterogeneous Integration
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Stretchable/Shrinkable Sensors and Electronics
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Wearable and Implantable Systems
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Degradable/Reusable Sensors and Systems
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Printed Large-Area Sensors and Systems
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Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
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Emerging applications of Flexible Electronics in AI, Robotics, Cognitive Systems, IoT, smart cities etc.
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Reliability, Simulation and Modelling
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Circular/Sustainable Electronics Using Beneficial Materials and Processes
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Standards for Flexible and Stretchable Electronics
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Flexible and Printed Integrated Circuits (ICs)
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Machine Learning for Flexible Electronic Materials Discovery and Design